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| * Stacked wafers to be unstacked one by one |
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* Eliminate surface damaged layer/form texture
(single crystal) |
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| Chemical etching equipment |
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| * Form anti reflective coating |
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| * Form electrode with Al paste or Ag paste |
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| High Precision Screen Printer for lnner Electrode, and Dryer |
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| * Form electrode with Ag paste |
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| High Precision Screen Printer for lnner Electrode, and Dryer |
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| * Plated copper wiring strips (tabs) are soldered |
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| *Line up cells and solder connect electrodes |
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| *Laminate cells with protection glass, filler and backside sheet |
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| * Test & measure electric characteristics |
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| Copyright (C) Wintech All Rights Reserved. |
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