積層セラミックコンデンサ生産設備
Production Equipment for Multi Layered Ceramic Capacitor(They vary depending on customers.)

Raw Material Dispersing
1:Dispersing Machine for Ceramic / Ni / Binder (分散/拡散)
2:Deaerator (脱泡)
3:Particle Size Analyzer (微粒子計測)
Coating
4:Coating Machine (コーター)
5:Green Sheet Thickness Measure (シート厚)
Printing
6:Rotary Screen Printing System (ロータリースクリーン印刷)
 Screen Printing System (スクリーン印刷)
 <Super High Precision Tension Control & Positioning> <超精密テンションコントロール&
位置決め>
7:IR + hotair Drying System (乾燥装置)
8:Electrode Thickness / Vision System (電極厚/印刷形状)
Stacking
9:Roll to Roll Stacking System (積層)
10:Stacked NG Finder (積層不良)
Pressing
11:5-Stage Vacuum Press(150/250/500T) (真空金型プレス)
12:Automatic Vacuum Pack Machine (自動真空包装)
Cutting / Dicing
13:Sheet Cutter (切断機)
14:Tungsten Carbide Blade (超硬)
Binder Bakeout
15:Bakeout Gas Oven (脱バイ)
16:Exhaust Gas Burning (排ガス燃焼)
Sintering
17:Automatic Chip Loading(onto setters)Machine (チップ自動サヤ空けサヤ詰め装置)
(チップ自動振込み整列装置)
18:Atmosphere Sintering Kiln (雰囲気焼成)
19:Roller Hearth Kiln (ローラーハース)
Grinding
20:Vertical Barrel (縦型遠心バレル)
21:Semi Auto Horizontal Barrel (半自動遠心バレル)
Termination Dipping
22:Automatic Chip Press(onto plates)Machine (チップ自動圧入・圧着装置)
23:Automatic Dipping Machine (外部電極塗布)
Firing Furnace
24:Firing Furnace for Cu outer electrode (外部電極焼付)
Visual Inspection
25:Visual Inspection System (外観検査)
26:Characteristic Inspection System (特性検査)
Taping
27:Taping Machine (テーピング機)

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